Lubricant

Lubricant - Heat dissipation compound

Heat dissipation compound

The heat dissipation compound is a product developed to reduce the thermal resistance of heat sources such as audio amplifiers and power transistors and heat dissipation fins and heat sinks. In recent years, in order to solve the thermal problem caused by the high integration of ICs, not only the thermal conductivity has been improved, but also non-diffusible products that suppress the diffusivity of the base oil have appeared, which is optimal for the needs of customers. We can propose measures against heat.


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